main advantages

Independently protect the three-dimensional cross structure (No.:. 9), improve equipment output rate WPH

Adopting independent design to optimize the internal airflow distribution of the whole machine and reduce particle pollution

Accurately control the amount of coating to reduce the consumption of photoresist

Equipped with multiple suction functions, it can effectively prevent nozzle crystallization

The cavity is equipped with an independent exhaust device, which can improve the uniformity of photoresist film thickness and reduce Wet Particle

High precision hot plate equipped with self-developed multi zone control

Independently developed control software that can optimize wafer transfer paths and shorten transfer times

Equipped with defect detection function, problems can be detected in a timely manner

Equipped with automatic testing function for mechanical and manual positions, improving efficiency

Support mainstream lithography machine interfaces

Characteristics and specifications

Suitable for cleaning 300mm wafers

Can be configured with 4 Loadports, up to 8 glue coating chambers and 8 developing chambers

Scalable support for 12 coating chambers and 12 developing chambers, with a wafer production capacity of up to 300 wafers per hour;

Chamber temperature: 23 ° C ± 0.1 ° C, baking range is 50 ° C to 250 ° C