PCB board red ink penetration testing machine

PCB board red ink testing machineIt is a specialized equipment based on penetration testing technology that locates small defects (such as cracks, pores, etc.) on the surface or inside of materials through the capillary action of dyes, and is widely used in the field of electronic manufacturing.

core principle

PCB board red ink testing machineUsing the capillary action of dyes, apply red dye (or ink containing penetrant) onto the surface of the object to be tested. Dyes penetrate into surface openings through capillary action, and after drying, the distribution of dyes in the defects can be observed to locate and determine the type and degree of defects. This principle is particularly important in the quality inspection of electronic assembly welding, as it can effectively identify defects such as virtual soldering, false soldering, and cracks.

Application field

The red ink testing machine has wide application value in multiple fields:

1. In the field of electronic manufacturing: It is a commonly used method to inspect the surface mount technology (SMT) of electronic components for solder joints or fractures. By observing the staining of solder joints, the welding quality can be judged, especially suitable for detecting solder joint contact abnormalities in BGA, CPU, pin packaging, PCB/PCBA and other products.

2. Sealing testing fieldUsing red ink as a tracer, inject the red ink into the interior or exterior of the test piece under pressure, observe whether there is any red liquid seepage or permeation, and accurately reflect the sealing performance of the test piece. This function is particularly important in fields such as automotive manufacturing (such as engine oil seals, fuel system pipeline testing), aerospace (such as aircraft fuel tanks, hydraulic pipeline testing), etc.

3. RMA Product ProcessingFor products returned by consumers, the red ink testing machine can detect the integrity and functionality of the products, helping companies screen out problematic returned products and improve the efficiency and quality of return processing.

Technical Specifications

1. 真空度0~-90kPa (i.e. -0.9Bar), using a digital negative pressure vacuum gauge, can accurately set the vacuum degree to ensure the stability of the testing environment.

2. precisionLevel 1, ensuring the accuracy of test results.

3. Effective size of vacuum chamber: Φ 270mm × 190mm (H) (standard), suitable for testing requirements of different sizes of specimens.

4. Overall dimensions400mm × 300mm × 200mm, compact design saves space.

5. Use power supply：AC 220V 50Hz， Adapt to common power environments.

6. Equipment weight：25kg， Easy to transport and install.

operating procedure

1. Sample preparationFix the sample to be tested on the test bench, ensuring that the test bench is stable and avoiding sample movement during the testing process that may affect the results.

2. Dye coatingDrop a drop of red ink on the surface of the sample, or place the sample in a red dye according to the testing requirements, so that the dye fully contacts the surface of the sample.

3. apply pressureApply pressure to the sample through a pressure device to allow the red ink to penetrate into the defects on the surface of the sample. The pressure value can be precisely controlled according to the testing requirements.

4. Observation and RecordingObserve the diffusion of red ink on the surface of the sample or its penetration into defects, and record relevant data. For solder joint detection, the solder joints are forcibly separated after drying, and the color status of the interface at the crack is observed to determine whether the solder joints are broken.

5. Data analysis and report generationTransfer the test data to the computer for data processing and analysis, and generate a detailed test report. The report may include information such as defect type, location, degree, etc., providing reference for subsequent production quality improvement.