Semiconductor packaging plasma cleaning machine

Semiconductor packaging plasma cleaning machineRemove particulate pollution and organic matter from the oxide layer to avoid virtual soldering

Application scope of microwave plasma cleaning machine in chip packaging process stage

Semiconductor packaging plasma cleaning machineSurface cleaning before chip bonding: Plasma cleaning can improve the wettability between the chip and the substrate, remove oxide films, thereby enhancing the bonding effect and improving product quality;

Surface cleaning before eutectic welding: Plasma cleaning can remove impurities on the substrate and oxide films on the solder, thereby reducing the generation of eutectic voids and improving the reliability and yield of eutectic;

Pre processing of wire bonding:Plasma cleaning machineEffectively remove photoresist in the bonding area, lead frame oxide film, organic pollutants in the process, etc., thereby achieving the goal of improving bonding strength and reducing bonding separation;

Surface treatment before chip encapsulation:Plasma cleaning machineImprove the wettability of the material surface, reduce packaging voids, and enhance its electrical performance;

In the chip packaging process, chip bonding/Eutectics → Lead Welding → Packaging →MarkWait for the production process and use microwavePLASMA plasmaCleaning machine, non-destructive precision components, does not affect the performance of the previous process,Automated plasma cleaning equipment, semiconductor packaging plasma etching machine, helps effectively improve the quality of chip packaging.

The treatment of plasma cleaning machines can improve welding quality, increase bonding strength, enhance reliability, improve quality, and save costs. Plasma cleaning can not only greatly improve adhesive strength and other properties, but also avoid secondary pollution caused by human factors.