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You'er Hongxin Testing Technology (Shenzhen) Co., Ltd
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You'er Hongxin Testing Technology (Shenzhen) Co., Ltd

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Temperature and humidity reliability testing

NegotiableUpdate on 03/12
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Overview
Temperature and humidity reliability testing includes temperature and humidity cycling test or temperature and humidity storage test, which accelerates the aging process of products by cycling between high temperature, low temperature, and humidity, in order to evaluate the reliability of products in actual use.
Product Details

Temperature and humidity reliability testingIt is an environmental reliability testing method that evaluates the performance stability, material durability, and functional reliability of a product by simulating the temperature and humidity conditions that the product may encounter in actual use. It is widely used in fields such as electronics, automotive, aviation, communication, medical, etc. to evaluate the performance and lifespan of products in actual use.

Temperature and humidity reliability testingIncluding temperature and humidity cycling test or temperature and humidity storage test, it accelerates the aging process of the product by cycling between high temperature, low temperature, and humidity, in order to evaluate the reliability of the product in actual use.

Temperature and humidity reliability test items

1. Constant Damp Heat Test (Constant Temperature and Humidity Test)

Standard:GB/T 2423.3(Corresponding toIEC 68-2-3

Common parameters: temperature40℃±2℃, humidity93%±3%RH, duration48-96hour

Purpose: Suitable for evaluating the performance changes of products with poor sealing in steady-state humid and hot environments

2. Alternating damp heat test

Standard:GB/T 2423.4(Corresponding toIEC 68-2-4

Common parameters:

Heating stage:25℃ rises to55℃ (humidity maintained)95%RH

High temperature and high humidity maintenance:55/95%RHmaintain4hour

Cooling stage:55℃ drops to25℃ (humidity not lower than)95%

Low temperature and high humidity maintenance:25/95%RHmaintain2hour

Purpose: Suitable for testing the anti condensation ability of products during sudden temperature changes

3. Temperature cycling test

Common parameters: temperature range-40~150℃, heating and cooling rate10/min

Purpose: To test the mechanical properties of materials under thermal expansion and contraction, and evaluate the adaptability and reliability of products in different temperature environments

4. Damp heat test (double)85

Common parameters: temperature85℃±2℃, humidity85%±3%RHcontinuously1000hour

Purpose: To accelerate material aging under high temperature and high humidity conditions, and verify the long-term reliability of products in high temperature and high humidity environments

5. High temperature storage test(HTST

Common parameters:150Continuous in a high-temperature nitrogen furnace at ℃500Hour or1000hour

Purpose: To test the performance stability of the product under long-term high temperature conditions, evaluate the impact of enhanced substance activity, substance migration and diffusion in the package on circuit performance

6. High acceleration temperature and humidity stress test(HAST

Common parameters:130℃、85%Relative humidity2.3Standard atmospheric pressure

Purpose: To accelerate the aging process of products by simulating high temperature, high humidity, and high pressure environments, with testing time reduced from traditional methods1000Shorten hours to96hour

7. Steam testing(PCT

Common parameters:130℃、85%Relative humidity2Standard atmospheric pressure

Purpose: Mainly to test the ability of packaged products to resist environmental humidity, and evaluate the humidity resistance of chip products under high temperature, high humidity, and high pressure conditions

Temperature and humidity reliability testing industry applications

1. Reliability testing of electronic products

Purpose: To evaluate the adaptability and stability of chip packaging components under temperature changes. Through testing, design defects such as short circuits and open circuits in the circuit, material damage, and structural mechanical deformation are discovered to improve product reliability

2. Automotive parts testing

Purpose: To evaluate the performance of automotive components under different climatic conditions, ensuring that the performance of vehicle components in high or low temperature environments is crucial for the safety and reliability of the vehicle

3. medical device

Purpose: To evaluate the performance of equipment and electronic components in humid environments, simulate in vivo or high humidity environments, accelerate the revelation of corrosion or failure modes, and enhance the safety and lifespan of medical devices

4. Materials Science and Energy Components

Purpose: To evaluate polymer materialsEVAThe performance of adhesive films, photovoltaic modules, etc. in humid and hot environments provides reliable data for building materials and new energy products, ensuring their long-term applicability in humid and hot environments. Such as validation of moisture-proof performance of photovoltaic modules and testing of new energy vehicle battery systems

5. Product design optimization and cost control

Purpose: To expose design defects in advance, reduce market recall risks, accelerate testing, shorten R&D cycles, optimize production processes, improve product consistency, reduce maintenance costs and recall risks

温湿度可靠性测试