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Thermal conductivity tester - transient plane heat source method for testing stability

NegotiableUpdate on 02/23
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Overview
Thermal conductivity tester - transient plane heat source method testing stability This instrument uses the transient plane heat source method. Based on the transient plane heat source technology, this instrument tests the thermal conductivity, thermal conductivity coefficient (thermal diffusion coefficient), specific heat capacity, thermal storage coefficient and thermal resistance of metals, alloys, graphite, thermal conductive silicone grease, silica gel, silicone rubber, ceramics, rock, polymers, paper, fabrics, foamed plastics, concrete, composite panels, paper honeycomb panels and other solid, powder, liquid, paste, coating, film, thermal insulation materials, thermal insulation materials, anisotropic materials, etc.
Product Details

Thermal conductivity tester - transient plane heat source method for testing stabilityThermal conductivity tester - transient plane heat source method for testing stability

Transient planar heat source testing machine/multifunctional rapid thermal conductivity tester/thermal conductivity tester - transient planar heat source method

1、 Description:
The instrument adopts the transient plane heat source method. Based on the transient plane heat source technology, the instrument tests the thermal conductivity, thermal conductivity coefficient (thermal diffusion coefficient), specific heat capacity, thermal storage coefficient and thermal resistance of solid, powder, liquid, paste, coating, film, thermal insulation material, thermal insulation material, anisotropic material and other materials: metal, alloy, graphite, thermal conductive silicone grease, silica gel, silicone rubber, ceramics, rock, polymer, paper, fabric, foam plastic, concrete, composite plate, paper honeycomb plate and so on.

2、 Execution standards

Standards: ISO22007-2:2008, GB/T32064-2015

3、 Technical parameters:

Control system: PLC+Windows system;

Operating interface: 12 inch embedded industrial computer in color, WiFi connection;

Wireless printing function, using fully automated testing software to quickly and accurately analyze the experimental process parameters of the sample and output reports;
Measurement range of thermal conductivity: 0.001-500w/(m.k), with a resolution of 0.0001w/(m.k);

Thermal diffusivity (thermal conductivity) range: 0.1-100m2/s;

Range of thermal storage coefficient: 0.1-30w/(m2. k);
Specific heat capacity range: 0.1-5kJ/(kg. ℃);

Thermal resistance range: 0.5-0.000005mm2.k/w;

Temperature measurement accuracy: ≤ 0.001 ℃;

Relative measurement error: ≤ 3%;

Repetitive error: ≤ 3%;

Test time: 1-120 seconds.
Sample testing environment temperature range: optional -40~150 ℃; Standard configuration: Room temperature.

Probe configuration: Standard configuration: Diameter of Φ 15mm.

Optional probe diameter: 30mm, 15mm, 7.5mm;
Power supply: AC220V ± 10%, 50/60Hz;

Whole machine power: < 500w;

Standard external dimensions: L761 * W500 * H786mm;

Optional external dimensions: length 921, width 600, height 856.5mm


4、 Probe technical specifications:
1. Heating material: nickel metal;
2. Operating temperature: -50~150 ℃;
3.Maximum power: 20W;
4.Maximum voltage: 20V;
5. Maximum current: 1A;
6. Resistance: around 10 Ω, according to the resistance value marked on the probe;
7. Nickel wire specification: thickness 0.01mm, hot wire width: 0.35 ± 0.03mm;
Hot wire spacing: 0.35 ± 0.03mm;
8. Protective layer material: polyimide film; Single layer thickness: 0.06mm;
9. Probe diameter: 30mm, 15mm, 7.5mm.
10. The total thickness of the probe (including the thickness of the bonding layer) is 0.07 ± 0.02mm.