Four chamber HMDS vacuum oven, computerized multi station HMDS oven

The main function of computerized multi station HMDS oven

The device rapidly, uniformly, and economically pretreats the substrate with hexamethyldisilane (HMDS) to improve the adhesion between the substrate and photoresist.

High quality photoresist adhesion is the foundation of all subsequent process steps. Only surfaces that have been fully coated can accurately reproduce sub micron level confocal apertures, avoiding problems such as edge bursting or trapping. The vacuum curing process can quickly dehydrate the substrate, ensuring that the excellent adhesion formed with the HMDS layer remains stable even after being exposed to atmospheric humidity for several weeks.

Four chamber HMDS vacuum oven, computerized multi station HMDS ovenProcess Characteristics

Chemical deposition uniformity

Better uniformity of contact angle

Moisture resistant surface treatment

The adhesion of photoresist can be increased by 3-5 times

Avoid filling voids and improve the quality of graphic transfer

Enhance photoresist adhesion

Hexamethyldisilane (HMDS) has lower consumption

Applicable industries: MEMS, filtering, amplification, power and other devices, wafers, sapphire, glass, precious metals, SiC (silicon carbide), GaN (gallium nitride), ZnO (zinc oxide), GaO (gallium oxide), gallium arsenide, lithium niobate, indium phosphide, diamond and other third-generation semiconductor materials.

Four chamber HMDS vacuum oven, computerized multi station HMDS ovenperformance

Capacity: 40L * 4, (compatible with 1-12-inch products and fragments) customizable

Operation application: 4-station independent control

Temperature range: RT+20-200 ℃

真空度： ≤1torr

Automation: computerized control+MES machine position control

Vacuum pump: oil-free vortex vacuum pump

HMDS liquid leakage alarm prompt function

HMDS low liquid level alarm prompt function

Process data recording function

Program lock protection and other functions