The difference between coupling agent vapor deposition machine and anti adhesive agent vapor deposition machine

The difference between coupling agent vapor deposition machine and anti adhesive agent vapor deposition machine

What are the uses of coupling agent vapor deposition machine and anti adhesive agent vapor deposition machine respectively:

Coupling agent vapor deposition machine

Silane coupling agents (HMDS tackifiers, vinyltrimethoxysilane, KH-550 silane, etc.) are an important class of organic silicon compounds that have been widely used in various fields such as material surface modification, composite material reinforcement, and preparation of Pirolin coatings. Pre photolithography adhesion treatment for wafers, mask plate adhesion treatment, LED chip technology, sapphire, precious metals, silicon wafers, indium phosphide (lnP), gallium arsenide (GaAs), lithium niobate (LiNbO), zinc sulfide (ZnS), mask plates, glass, quartz wafers, wafers, silicon carbide and other substrates, MEMS manufacturing, microfluidic technology, and third-generation and fourth generation semiconductor materials processes.

Anti adhesive agent vapor deposition machine

Aerospace new materials hydrophobic treatment, ceramic fiber board hydrophobic treatment, ceramic fiber cotton hydrophobic agent evaporation.

Mobile phones and tablets: anti fingerprint, waterproof treatment, etc.

nanoimprintNanoimprint demolding stage, anti adhesive evaporation process.

The difference between coupling agent vapor deposition machine and anti adhesive agent vapor deposition machineSimilarities:

Studio size (mm): 300 × 300 × 300

450×450×450

1000×1000×1000

1700×1800×1500

customizable

Material: 316L grade stainless steel working chamber

Control mode: Color touch screen operation, one click operation

Protector:

earth leakage protection

overtemperature protection

Program self-locking protection