main advantages

Fully protect the backside of the wafer with Bernoulli chuck

The drug recovery function can reduce costs

Can integrate nitrogen two fluid cleaning function

Can be flexibly applied to wet etching processes, such as silicon etching and thin film etching processes

Advanced nozzle scanning system

Precise wet etching uniformity control

Precise chemical solution supply

Flexible application to various substrate materials, including heavily doped sheets, bonding sheets, ultra-thin sheets, etc

Characteristic specifications

Up to 8 sets of cleaning chambers can be equipped

Equipped with wafer flipping unit

Up to 5 types of chemical solutions can be used for cleaning or wet etching processes, including RCA solution, hydrofluoric acid, hydrofluoric acid/nitric acid mixture, formula solution, etc

Bernoulli chuck provides comprehensive protection for the backside of chips

Up to 2 types of chemical solutions can be recycled