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Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
Wet adhesive removal equipment - limestone gypsum wet process
NegotiableUpdate on 02/15
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Overview
Shengmei's semiconductor wet stripping equipment is designed specifically for efficient and convenient photoresist (PR) stripping and cleaning applications.
Product Details
Wet adhesive removal equipment
Slot type debonding unit - soaking wafers with liquid medicine in the slot type unit, which can accommodate multiple wafers at once to increase production capacity.
Single wafer debonding chamber - sprays the liquid onto the rotating wafer surface, allowing for better independent control of each wafer process.
Single wafer debonding chamber - sprays the liquid onto the rotating wafer surface, allowing for better independent control of each wafer process.
main advantages
Easy to use
Accurate medication control
Trough type unit pre soaking process
Recycling and using medicinal liquids can reduce costs
Optimize security configuration
Combining advanced wafer cleaning technology
Characteristics and specifications
Compatible with 8-inch and 12 inch wafers
Equipped with soaking tank body
Equipped with a single debonding chamber, including:
a. Up to 5 types of medication can be prepared for double-sided cleaning process
b. Up to 2 types of medicinal liquids can be recycled
c. A single cavity can carry spatially alternating phase shifted terahertz (SAPS) components
d. Optional high-pressure solvent/DIW spray cleaning
