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DuPont etching solution

NegotiableUpdate on 01/31
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Overview
DuPont&Trade; plasmasolv® ekc270™ Removal of residues after etching, contact cleaning, metal line cleaning, TSV deep silicon perforation cleaning, etc
Product Details

After more than 200 years of relentless innovation, DuPont is entering a new era of exploration and discovery. Our community, including researchers, engineers, visionary individuals, and all partners, work together day after day to turn various possibilities into real-world products and solutions, promoting the flourishing development of human society. Understand how DuPont is committed to creating a better world.


Features:

Establish the integrity of the metal stack for Zui Jia

Improve the wide window processing capability

Strengthen the removal of etching residues

The cleaned mask reduces chemical residues

Ultra Large Scale Integrated Circuit (ULSI) level specification * for package cleaning

Low evaporation rate at working temperature


Application:

Application EKC270 ™ Etched residue collectors are widely used in the semiconductor industry to meet critical cleaning needs

From high aspect ratio MEMS devices to 100μm+Various stages of 70nm integration into DRAM

The following are common applications:

  • Contact cleaning

  • Metal wire cleaning

  • TSV deep silicon perforation cleaning

  • Tungsten buried line cleaning

  • Polyimide cleaning

  • Pad cleaning

  • MEMS cleaning

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