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Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
Edge wet etching equipment
NegotiableUpdate on 02/15
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Overview
Shengmei Shanghai's edge wet etching equipment supports a variety of devices and processes, including 3D NAND, DRAM, and advanced logic processes. It uses wet etching methods to remove various dielectric, metal, and organic material thin films, as well as particulate contaminants from the wafer edges.
Product Details
Edge wet etching equipment
main advantages
Used for etching and cleaning of various stacked thin film layers at the edge of wafers, improving the yield of advanced wafer edges
High etching precision, adjustable etching width
Independent technology can achieve more precise and efficient wafer alignment, with high control accuracy and uniformity, and can achieve precise edge etching
High production capacity, low chemical consumption
Equipment and processes can be extended to process technology nodes below 10nm
The etching of lower layer materials has the characteristics of high selectivity and no damage to the wafer
Excellent wafer edge cleaning capability, better particle control
Flexible application to various substrate materials, including heavily doped sheets, bonding sheets, ultra-thin sheets, etc
Characteristics and specifications
Suitable for edge cleaning of 12 inch wafers
Up to 4 Lord Ports can be configured
12 process chambers can be configured
Vacuum chuck clamps the wafer
It can clean the front and back edges of the wafer, and can be equipped with up to 5 types of chemical solutions for cleaning processes
Each cavity is equipped with high-precision wafer alignment units
Configurable high-precision wafer edge detection unit
