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Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
electroplating equipment
NegotiableUpdate on 02/15
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Overview
Shengmei Semiconductor's advanced packaging electroplating equipment can be applied to the key electroplating steps of multi-channel advanced packaging, including pillar, bump, and RDL. This electroplating equipment can also be used for fan out, TSV (Through Silicon Via), and TMV (Through Molding Via) processes.
Product Details
electroplating equipment
main advantages
Horizontal electroplating chamber, no cross contamination
Can be maintained in a single chamber to improve equipment up time
Rubber sealing technology for better sealing performance
Second anode technology for better control of uniformity
Flexible process control
Characteristics and specifications
兼容8寸和12寸
Up to 3 load ports can be configured
Up to 4 types of pre wetting chambers, vacuum controlled
Up to 4 cleaning chambers can be configured
Up to 20 electroplating chambers can be configured: Cu, Sn/Ag, Ni
Equipment size: 2050 x 5950 x 2650 mm
Process performance:
Intra slice uniformity:<5% (- minimum/2 average)
Inter slice uniformity<3%
Repeatability:<3%
COP: < 2.0 µm
