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Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
SAPS Megasonic Cleaning Equipment
NegotiableUpdate on 02/15
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Overview
Shengmei * Technology - Spatial Alternating Phase Shift (SAPS™) technology, by controlling the distance between the megasonic cleaning device and the wafer to vary with the megasonic phase, achieves uniform distribution of megasonic waves on the wafer surface to achieve a clean effect.
Product Details
SAPS Megasonic Cleaning Equipment
• Deep trench cleaning
Cleaning after CMP
Clean after Hard Mask deposition
Contact/Via etched and cleaned
Cleaning before Barrier Metal deposition
• Wafer recycling and cleaning
EPI pre deposition cleaning
• Cleaning before ALD deposition
Features and specifications (Ultra C SAPS II)
Up to 8 chambers can be configured, with a production capacity of 225WPH
Double sided cleaning, up to 5 types of cleaning solutions can be prepared, such as DHF SC1, SC2, DIO3, BOE, Solvent, HF/HNO3…
Up to two types of medication can be recycled
Integrated drug supply module
Small device size: 2.35m x 5.53m x 2.85m (width x length x height)
Features and specifications (Ultra C SAPS V)
Having all Ultra C SAPS II equipment capabilities
Up to 12 chambers can be configured, with a production capacity of 375 WPH
Integrated chemical solution supply module
High temperature IPA drying technology that can be matched
Equipment volume: 2.35m x 6.7m x 2.85m (width x length x height)
