-
E-mail
123@qq.com
-
Phone
13112345679
- Address
Product Categories
Shengmei Semiconductor Equipment (Shanghai) Co., Ltd
SAPS Megasonic Cleaning Equipment
NegotiableUpdate on 02/15
- Model
- Nature of the Manufacturer
- Producers
- Product Category
- Place of Origin
Overview
Shengmei * Technology - Spatial Alternating Phase Shift (SAPS) technology, by controlling the distance between the megasonic cleaning device and the wafer to vary with the megasonic phase, achieves uniform distribution of megasonic waves on the wafer surface to achieve a clean effect.
Product Details
SAPS Megasonic Cleaning Equipment
• Deep trench cleaning
Cleaning after CMP
Clean after Hard Mask deposition
Contact/Via etched and cleaned
Cleaning before Barrier Metal deposition
• Wafer recycling and cleaning
EPI pre deposition cleaning
• Cleaning before ALD deposition
Features and specifications (Ultra C SAPS II)
Up to 8 chambers can be configured, with a production capacity of 225WPH
Double sided cleaning, up to 5 types of cleaning solutions can be prepared, such as DHF SC1, SC2, DIO3, BOE, Solvent, HF/HNO3…
Up to two types of medication can be recycled
Integrated drug supply module
Small device size: 2.35m x 5.53m x 2.85m (width x length x height)
Features and specifications (Ultra C SAPS V)
Having all Ultra C SAPS II equipment capabilities
Up to 12 chambers can be configured, with a production capacity of 375 WPH
Integrated chemical solution supply module
High temperature IPA drying technology that can be matched
Equipment volume: 2.35m x 6.7m x 2.85m (width x length x height)
