wire bonder

French JFP is a manualsemi-automaticwire bonderThe manufacturer's products are particularly suitable for the needs of electronic packaging from experimental research to small-scale trial production.

The newly designed WB-200 semi-automatic fine wire bonding machine is very suitable for laboratory research and development, product prototype trial production, product evaluation, product repair, etc. Under limited budget, it is necessary to ensure high-quality bonding for users.

WB-200 semi-automaticwire bonderCan perform ball welding, wedge welding, gold wire bonding, jump welding (Pump), etc.

Technical specifications and features:

• Wedge welding, ball welding, jump welding;

• Semi automatic and manual key mode;

• Wire diameter: 17 μ m-50 μ m;

• Welding arm length: 165mm (6.7 ");

• Welding head entry depth: 16mm;

• Can store 50 programs; 50 steps per program

• Motor driven Z-axis pressure head;

• Temperature controlled heating, up to 250 degrees, automatic wire feeding;

• Digital control, LCD display;

• Digital programming: bonding force, bonding time, temperature and other bonding parameters;

• Vertical camera;

• Side camera optional;

Reference customer:

Chinese Academy of Sciences Nanotechnology Center; Shenzhen University, Xi'an Jiaotong University